Support for reducing scratches in wafer polishing for semiconductors.
It helps suppress variations and fine scratches generated during the precision polishing of semiconductor wafers, supporting the achievement of high flatness and stable surface quality.
In the precision polishing process of semiconductor wafers, issues such as polishing unevenness and fine scratches can arise. These can affect the yield of subsequent processes and the performance of the final product, making the stabilization of processing conditions essential. Our non-woven polishing pads are designed for precision polishing that requires high flatness and surface quality. With features that support uniform polishing, they help reduce polishing unevenness and stabilize processing quality. Additionally, their excellent workability contributes to reducing variations in processing conditions. They can also be considered for polishing various materials that require high flatness, including semiconductor wafers. Since results may vary depending on processing conditions, we recommend confirming through preliminary testing. 【Features】 ■ Supports uniform polishing and contributes to the suppression of polishing unevenness ■ Assists in reducing fine scratches and improving surface quality ■ Excellent workability helps suppress variations in processing conditions ■ Supports the coexistence of high flatness and excellent surface quality ■ Suitable for precision polishing processes, including semiconductor wafers *For more details, please refer to the related links or feel free to contact us.
- 企業：八千代マイクロサイエンス
- 価格：Other
